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Product

LPM

  • FOUP Load / Unload / Mapping
  • RFID , E84
  • Convenient maintenance
LPM

Features

  • A device that loads/unloads wafers in the semiconductor manufacturing and processing. Improves productivity and minimizes errors by handling wafers safely and managing the connection between the processing equipment and wafers.

Specification

Specification

Model

Object Size

Cassette

Mapping

Interface

RLS-3100

300mm

FOUP/FOSB

Exist/Cross/Double

RS232C

RLS-5100

200/300mm

FOUP/FOSB

Exist/Cross/Double

RS232C

RLS-BS00

300 x 300mm

PCB FOUP

Exist

RS232C

RLS-7S00

600 x 600mm

PCB FOUP

Exist

RS232C

RLS-3300

300mm

Ring Frame CST

Exist/Cross/Double

RS232C

RLS-2100

200mm

POD

Exist

RS232C